Dissimilar diffusion bonding of bulk metallic glass: Amorphous/crystalline atomic-scale interaction

Saadati A.; Malekan M.; Khodabakhshi F.; Wilde G.; Gerlich A.P.

Research article (journal)

Abstract

Dissimilar diffusion welding of a copper-based bulk metallic glass (BMG) with a stoichiometry of Cu50Zr43Al7 and commercial pure aluminum was performed at evaluated different temperatures (below and higher than the glass transition temperature ∼ 440 °C) and holding times (up to one hour). The main goal was to successfully bond these dissimilar materials without crystallizing the BMG part to avoid deteriorating properties. Optimum joining conditions were attained at a temperature of 430 °C (

Details zur Publikation

Publisher:
Release year: 2023
Publishing company: Elsevier Inc.
Language in which the publication is written: English
Link to the full text: https://api.elsevier.com/content/abstract/scopus_id/85142703207