Dissimilar diffusion bonding of bulk metallic glass: Amorphous/crystalline atomic-scale interaction

Saadati A.; Malekan M.; Khodabakhshi F.; Wilde G.; Gerlich A.P.

Forschungsartikel (Zeitschrift)

Zusammenfassung

Dissimilar diffusion welding of a copper-based bulk metallic glass (BMG) with a stoichiometry of Cu50Zr43Al7 and commercial pure aluminum was performed at evaluated different temperatures (below and higher than the glass transition temperature ∼ 440 °C) and holding times (up to one hour). The main goal was to successfully bond these dissimilar materials without crystallizing the BMG part to avoid deteriorating properties. Optimum joining conditions were attained at a temperature of 430 °C (

Details zur Publikation

Herausgeber*innen:
Veröffentlichungsjahr: 2023
Verlag: Elsevier Inc.
Sprache, in der die Publikation verfasst ist: Englisch
Link zum Volltext: https://api.elsevier.com/content/abstract/scopus_id/85142703207